Invitation to BOCHK Science and Technology Innovation Prize Info Session (FinTech Field)
Event Details
Theme: BOCHK Science and Technology Innovation Prize Info Session (FinTech Field)
Date &Time: 22 August 2022 (Monday), 4:30 p.m.
Venue: Go Green, Unit 403, 4/F, Cyberport 3
Content: 1. Introduction of STIP
2. Dialogue with Panel Members of FinTech Field
3. Q&A
Speakers:
Prof. Kam Fai WONG
Vice Chairman & Secretary General of Hong Kong Alliance of Technology and Innovation
Associate Dean (External Affairs), Faculty of Engineering, CUHK
Mr. James Henry LAU Jr.
Chairman of Fintech Panel, STIP
Non-Executive Director & Chairman of Ping An OneConnect Bank (Hong Kong) Limited and OneConnect Financial Technology (Hong Kong) Co. Ltd
Hon. Mr. Duncan CHIU
Member of Fintech Panel, STIP
Member of Legislative Council, HKSAR
Moderator:
Mr. Hoi Shan HSU
Deputy Secretary General of Hong Kong Alliance of Technology and Innovation
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